firstlevelinc.com

first level inc - Home

first level inc. is a technology based contract assembly facility specializing in first level microelectronics packaging. The company has Class 10,000 ESD protected cleanrooms for die attach, wire bonding, and component assembly. Expert engineers and highly skilled technicians provide design, process, and manufacturing services.
history traffic contact

OVERVIEW

This site firstlevelinc.com presently has a traffic classification of zero (the smaller the superior). We have explored four pages within the web site firstlevelinc.com and found two websites interfacing with firstlevelinc.com. We were able to observe one contacts and locations for firstlevelinc.com to help you correspond with them. This site firstlevelinc.com has been online for one thousand two hundred and eighty-nine weeks, nineteen days, eleven hours, and fifty-seven minutes.
Pages Crawled
4
Links to this site
2
Contacts
1
Locations
1
Online Since
Mar 2000

FIRSTLEVELINC.COM RANKINGS

This site firstlevelinc.com is seeing variant amounts of traffic for the whole of the year.
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FIRSTLEVELINC.COM HISTORY

This site firstlevelinc.com was first submitted to the registrar on March 28, 2000. This website was changed on March 15, 2012. This web site will expire on March 28, 2015. It is currently one thousand two hundred and eighty-nine weeks, nineteen days, eleven hours, and fifty-seven minutes old.
REGISTERED
March
2000
UPDATED
March
2012
EXPIRED
March
2015

DOMAIN PERIOD OF EXISTANCE

24
YEARS
8
MONTHS
18
DAYS

LINKS TO WEB SITE

Mirror Semiconductor M-QFN preplated NiPdAu Open Air Cavity QFN Protype IC packaging for MPW Multi-Project wafer MPW foundry shuttle service. Wafer foundries. Pre moulded. Chip Assembly, Chip packages , Open Cavity QFN. . . . M-QFN8W.65-G5 , M-QFN12W.5-

Bull;MEMS, RF, sensor, and silicon applications. Bull;Ready for die attach and wire bonding. Bull;For engineering and rapid prototypes. Bull;40 open tooled packages. Bull;Complies to JEDEC Standard MO-220 VQFN. Window for probing into cavity. Packages and lids for evalution. DXF, SAT, IGES, STEP and PDF drawings center. Df , Dk, ε , δ.

WHAT DOES FIRSTLEVELINC.COM LOOK LIKE?

Desktop Screenshot of firstlevelinc.com Mobile Screenshot of firstlevelinc.com Tablet Screenshot of firstlevelinc.com

CONTACTS

First Level, Inc.

First Level, Inc.

3109 Espresso way

York, PA, 17402

US

1.7172662450
jsheriff@firstlevelinc.com

FIRSTLEVELINC.COM HOST

We found that a lone root page on firstlevelinc.com took one thousand one hundred and fifty-eight milliseconds to stream. Our parsers could not discover a SSL certificate, so in conclusion I consider firstlevelinc.com not secure.
Load time
1.158 secs
SSL
NOT SECURE
Internet Protocol
192.186.254.33

NAME SERVERS

ns1.speedydns.net
ns2.speedydns.net

WEBSITE IMAGE

SERVER OS

I detected that firstlevelinc.com is operating the Apache operating system.

PAGE TITLE

first level inc - Home

DESCRIPTION

first level inc. is a technology based contract assembly facility specializing in first level microelectronics packaging. The company has Class 10,000 ESD protected cleanrooms for die attach, wire bonding, and component assembly. Expert engineers and highly skilled technicians provide design, process, and manufacturing services.

CONTENT

This site states the following, "Is a technology based contract assembly facility specializing in first level microelectronics packaging." We noticed that the web site stated " The company has Class 10,000 ESD protected cleanrooms for die attach, wire bonding, and component assembly." It also stated " Expert engineers and highly skilled technicians provide design, process, and manufacturing services. We want to be part of your team. 3109 Espresso Way, York, Pa." The header had First Level Inc as the highest ranking keyword. It was followed by first level microelectronics packaging, wire bonding, and contract manufacturing which isn't as ranked as highly as First Level Inc. The next words the site uses is cleanrooms. die attach was also included and will not be seen by web engines.

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